Phosphor-Copper brazing alloy is easy-flow, low-cost and has good processing property and self-braze ability. It applies to contact brazing、gas flame brazing, induction brazing and furnace brazing, the joint has high tensile strength and good electrical conductivity. Silver-Phosphor-Copper brazing alloy can reduce the melting points, in can improve both alloy's plasticity and wet ability, as well as the alloy's strength and toughness.
中國(guó)標(biāo)準(zhǔn)牌號(hào) Chinese Standard |
相當(dāng)牌號(hào) Equivalent Grade |
化學(xué)成分(Wt%) Composition |
熔化溫度范圍(℃) Melting Range |
主要特性及用途 Characteristics and Application |
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產(chǎn)品樣本牌號(hào) | AWS A5.8 | Ag | P | Cu | Sn | Ni | 固相線 Solidus |
液相線 Liquidus |
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B-Cu92P | ___ | ___ | ___ | 7.5 ~ 8.5 |
余 rem. | ___ | ___ | 714 | 750 | 熔點(diǎn)低,流動(dòng)性較好,但脆性大,一般用于釬焊不受沖擊載荷、無(wú)振動(dòng)的銅和黃銅零件。 |
B-Cu93P | 料201 | BCuP-2 | ___ | 6.8 ~ 7.5 |
余 rem. | ___ | ___ | 714 | 793 | 流動(dòng)性好,可以流入間隙很小的接頭,釬料脆,用于機(jī)電和儀表工業(yè),釬焊不受沖擊載荷的銅和黃銅零件 。 |
B-Cu89SnP | 料208 | ___ | ___ | 5.5 ~ 7.5 |
余 rem. | 5.0 ~ 6.0 |
___ | 620 | 660 | 熔點(diǎn)低,流動(dòng)性好,配合銀釬劑釬焊銅、青銅及低鋅黃銅 |
B-Cu86SnP | ___ | ___ | ___ | 4.8 ~ 5.8 |
余 rem. | 7.0 ~ 8.0 |
0.4 ~ 1.2 |
620 | 670 | 用途同上,鎳的加入使脆性增大,但流動(dòng)性提高,釬縫光亮。 |
B-Cu91PAg | 料209 | BCuP-6 | 1.8 ~ 2.2 |
6.8 ~ 7.2 |
余 rem. | ___ | ___ | 645 | 788 | 能在較大溫度范圍內(nèi)填充接頭間隙,用于電冰箱、空調(diào)器、電機(jī)和儀表行業(yè)釬焊銅及黃銅。 |
B-Cu89PAg | ___ | BCuP-3 | 4.8 ~ 5.2 |
5.8 ~ 6.7 |
余 rem. | ___ | ___ | 645 | 780 | 用途同上,釬料延性和導(dǎo)電性得到提高,流動(dòng)性一般,適宜于釬焊間隙較大的零件。 |
B-Cu88PAg | 料205 | BCuP-7 | 4.8 ~ 5.2 |
6.5 ~ 7.0 |
余 rem. | ___ | ___ | 645 | 771 | 用途同上,釬料延性和導(dǎo)電性得到提高,流動(dòng)性好于B-Cu89PAg。 |
B-Cu87PAg | ___ | BCuP-4 | 5.8 ~ 6.2 |
7.0 ~ 7.5 |
余 rem. | ___ | ___ | 645 | 718 | 熔點(diǎn)低,流動(dòng)性很好,能釬焊間隙較小的接頭,用于銅及黃銅釬焊。 |
B-Cu80AgP | 料204 | BCuP-5 | 14.5 ~ 15.5 |
4.8 ~ 5.3 |
余 rem. | ___ | ___ | 645 | 815 | 釬料的延性和導(dǎo)電性得到進(jìn)一步的改善,用于釬焊要求比HL205釬料高的接頭間隙較大的銅及黃銅零件。 |